Lugar de origem
Guangdong, China
Min. Tamanho do furo
0.3mm
Revestimento de superfície
HASL,Immersion gold,Flash gold, plated silver, OSP
Tamanho da Placa
L50*W50MM
Assembly Type
FPC, FR4, Rigid-flex pcb, mcpcb
Min Assembly Specification
50mm*50mm
Max Assembly Specification
510mm*460mm
Components DIP
01005 Chip/0.35 Pitch BGA
Min device accuracy
+/- 0.04mm
Min footprint distance
0.3mm
Application
Telecommunication, Computer Application, Consumption Electronics