Lugar de origem
Henan, China
Espessura da lâmina
0.014in
Altura da borda
0.315in (8mm)
Tipo de Processo
Imprensa quente, Soldada de alta Freqüência, Soldadas a laser, Imprensa fria
Application
processing silicon crystal materials, polishing stone, marble, granite
Performance Comparison
Sharp or wear diamond blade
Size
outside diameter 100 mm, inner hole 20/16 mm
Dimension of Thickness
1.5-3 mm
applicable machine
angle grinder
Product Name
Tungsten Carbide Buffing Grinding discs