Lugar de origem
Guangdong, China
Matéria- prima principal
Epóxi
Uso
construção, Embalagem, Electrical appliances
Outros Nomes
Chip bottom filling potting epoxy primer
Classificação
Outros Adesivos
Tipo
Chip bottom filling potting epoxy primer
Product name
Chip bottom filling potting epoxy primer
Material
One-component potting materials
Storage temperature
-20-8℃
Use
for CSP, WLCSP and BGA applications
Color
Light yellow to amber
Product Description
reusable underfill
Curing system
cure quickly at moderate temperatures
Feature
higher glass transition temperature and higher fracture toughness
Glue type
Epoxy resin-based